Summit Wireless Management Team
Brett A. Moyer
CEO, President & Director
Brett A. Moyer joined the company in May 1997. On September 30, 2002 Mr. Moyer assumed the role of President and Chief Executive Officer and became a member of the Board of Directors. From May 1997 to September 29, 2002, Mr. Moyer served as Executive Vice President and Chief Operating Officer. From February 1986 to April 1997, Mr. Moyer worked at Zenith Electronics Corporation, Glenview, Illinois, where he had most recently been the Vice President and General Manager of Zenith's Commercial Products Division. Mr. Moyer is also a member of the Board of Directors of NeoMagic Corporation (NASDAQ GM: NMGC), a developer of semiconductor chips and software that enable multimedia applications for handheld devices and HotChalk, a developer of software for the educational market. Mr. Moyer has a Bachelor of Arts in Economics from Beloit College in Wisconsin and a Masters of International Management with a concentration in finance and accounting from The American Graduate School of International Management (Thunderbird).
Gary L. Williams
Secretary, Executive Vice President of Finance & CFO
Gary Williams has served as Secretary, Executive Vice President of Finance and CFO since February 2005. Mr. Williams joined as Secretary, Vice President of Finance and CFO in January 2001, in connection with the acquisition of Videonics, Inc. Mr. Williams had served Videonics as Vice President of Finance, CFO and Secretary since February 1999. From February 1995 to January 1999, Mr. Williams served as Videonics' Controller. From July 1994 to January 1995, he served as Controller for Western Micro Technology, a publicly traded company in the electronics distribution business. From January 1990 to June 1994, Mr. Williams worked in public accounting for Coopers & Lybrand LLP. Mr. Williams is a Certified Public Accountant and has a Bachelors Degree in Business Administration, with an emphasis in Accounting, from San Diego State University.
Vice President of Worldwide Sales
Rob Sharpe recently joined Summit Semiconductor as Vice President of Worldwide Sales. Mr. Sharpe has over 23 years of experience in the semiconductor industry, with extensive expertise in wireless, ASIC, embedded controller, and memory technologies. He has been involved in multiple startups as well has having large company experience. Mr. Sharpe has been directly responsible for creating over $1B in revenue during his career. Prior to joining Summit Semiconductor he was Vice President of Sales with Alereon, an ultra wideband (UWB) IC solutions company. Prior to that, he was Vice President of Worldwide Sales for Wisair, also a leader in the UWB and wireless peripherals space. Previously, Mr. Sharpe held sales management, technical marketing and engineering roles at Silicon Labs, Hyundai Semiconductor (now known as SK Hynix), Mitsubishi Semi, Hitachi Semiconductor and Link Flight Simulation. Mr. Sharpe holds a BS degree in Electrical Engineering with a focus in RF design from Santa Clara University in Santa Clara, CA.
Vice President of Operations
Ed Green joined the company in January 2005, and became Vice President of Operations in January 2009. Currently reporting to Mr. Green are the Production & Test Engineering, Quality and Reliability, and the IT departments. Prior to joining Summit Semiconductor Inc., Mr. Green held several positions at Network Elements Inc., Beaverton, OR. Most recently, Mr. Green was Product Line Manager for NEI's 10 Gigabit Ethernet group. Mr. Green was the driving force behind NEI's XENPAK, X2 and XFP programs. Over Mr. Green's four year career at NEI, he was responsible for all design-for-test (DFT) on NEI's 10Gb/s SERDES IC, and validation of NEI's first multi-protocol ASIC. In 2000, Mr. Green served as Chief Operating Officer for Sunhoo.com based in Shanghai, China. There, Mr. Green was responsible for the development and implementation of the company's business model and plan for a financial web portal in China. For the seven years prior to Sunhoo.com, Mr. Green operated a small chain of family entertainment centers. Mr. Green was responsible for all design, construction, implementation, management, and financial and corporate matters involving the company's five stores and 70 employees. Mr. Green earned his BS in Electrical Engineering in 1983, and his MBA in Accounting in 2004.
Vice President of Marketing
Tony Parker joined the company in September 2007 as Vice President of Product Marketing. Mr. Parker has 25 years of experience in semiconductor marketing leadership, with extensive expertise in wireless markets, including WiFi and UWB. Prior to joining Summit Semiconductor he was director of marketing with Cirrus Logic for ARM system-on-chip solutions and audio DSP products for decoding and post processing of sound effects targeting AVR, DTV and automotive applications. Prior to that, he was senior manager of corporate strategy and technology for Agere Systems, directing and leveraging company-wide resources across multiple product families including data networking, mobile, and storage businesses. Parker also has a proven track record of developing and delivering the right products to semiconductor markets while working in key product management and marketing management positions at Texas Instruments, AT&T, and Lucent Technologies. Mr. Parker holds a BS degree in Electrical Engineering from Bradley University, Peoria Illinois, as well as an MBA degree from Syracuse University, Syracuse, NY.
Vice President of Engineering
Keith Greeney joined the company in September 1994, and became Vice President of Engineering in June 2011. Mr. Greeney manages five groups within Summit Semiconductor; Research and Development, System Testing, FW Development, Application Development, and Reference Design Development. Mr. Greeney has over 25 years of experience in Firmware, Hardware, Digital Signal Processing (DSP) and ASIC design. He began his career as a system configuration manager at Applied Research Laboratories while pursuing a BSEE from the University of Texas at Austin. Prior to joining Summit Semiconductor, Mr. Greeney was a key contributor to Tektronix' Federal Systems, the group responsible for developing the world's first real-time digital spectrum analyzer, the Tektronix 3052. Along with algorithm design and design-for-test (DFT) responsibilities for the 3052, Mr. Greeney developed and implemented the production line. At Summit Semiconductor, he is responsible for the successful design and implementation of over 10 ASICs ranging from scan converters, alpha blenders, UWB and Wireless Audio for key customers including Bang & Olufsen, Intel, and Microsoft Xbox.